Senior Embedded Hardware Design Engineer, Richmond Hill

iENSO makes intelligent, connected vision systems for companies that need to embed cameras, image processing, Edge AI, and data connectivity capabilities in their products. We take a platform-based approach called EVPaaS™ (Embedded Vision Platform as a Service) to let you focus on your core strengths while we deliver the rest.We’ve been doing that and only that for over twenty years as pioneers, leaders and masters of a global network of design, engineering and manufacturing expertise that will make your vision a reality. Type: Salaried, Full-Time (40 hours per week) Date Posted: March 02, 2026 Salary: $95k to $135k depending on experience and qualifications + BenefitsRequirements

Education Requirements Bachelor’s and/or Master’s degree in Electrical Engineering or related field Experience Requirements Minimum of 10 years of related experience in an engineering design and development environment Design and Development Knowledge Embedded system architecture and designMCU and high-speed design Design with camera specific DSP / SoC chips Embedded&Analog Circuit Design for Imaging and Camera related products Knowledge of PSPICE or equivalent for modeling of circuits PCB design and Layout using ALTIUM and/or PADs Layout rules and standards IPC 2221. IPC-A-610 Designing with dense BGA chips, DDR types of memory, and different data-bus typesKnowledge of UART, I2C, SPI, GPIO, PLL, ADC, MIPI, SDIO, ETH JTAG, serial FLASH Power chain, power up, power down, charging and power budget creation Understanding of embedded OS booting sequence and design implications Understanding low-noise analog design and EMI compliance considerations Ability to write basic test code in C or C++ for bringing up and prototyping newly designed boards, a plusFPGA circuit design and related SW (VHDL), a plus Tools and Testing Hands on with prototyping circuits and ability to repair and rework for debugging and bringing up prototype PCBAs Hands‑on experience with oscilloscopes, spectrum analyzers, VNAs, DVMs, logic analyzers, and other design and development supporting instruments and toolsMS Windows / MS Office PM software Confluence Jira Version control Software Team and Aptitude Dedicated and honest Able to work independently as needed, and work closely with others as team player for joint tasks Ability to think fundamentally Strong problem‑solving skills, fast learning, and multi‑taskingTaking initiative and ownership Other requirements Previous experience with imaging and computer vision would be an asset Canadian Citizenship or Permanent resident status Ability to travel outside Canada Reporting to the Director of Systems Engineering, the

Senior Embedded Hardware Design Engineer

designs and develops hardware for embedded systems such as digital high‑performance cameras, embedded systems that include wireless modules such as WiFi or Bluetooth&Cellular modem subsystems, high‑speed data bus systems, and general imaging and vision related subsystems. Working closely with mechanical and software engineers the position is responsible for selecting new components, designing digital imaging systems and subsystems, conducting various tests on prototypes, supporting and overseeing electrical certifications, and supporting the OPs team to transition designs to manufacturing.Essential duties and high‑level responsibilities

Digital camera high speed board design Embedded imaging system power supply design Supporting of EMI/EMC and other electrical certifications Design with wireless modules, cellular modems, LCD modules, CODECs and various sensor chips Transition of designs to Mass Production and DFM Position Scope and Responsibilities

Collaboratively define, create and review embedded imaging related architectures and embedded HW designs with respect to: System architecture and design aspect Power flow and power integrity General Signal flow and connector placement for DFM EMI/EMC considerations DFM and Thermal considerationsCritical component selection Closely interface with the other development teams for: Ensuring and validating component specifications Defining hardware testing and developing testing requirements and protocols Performing product Mech‑Elec integration and product testing Reviewing designs for DFM and power integrityTransitioning and supporting designs for EMI testing and other electrical testing such as PTCRB Define internal product specification and preliminary BOM as it relates to: Working with the Product and Engineering teams to define and maintain product HW specification Selecting components for design suitability and costPutting together approximate BOM list tied to the design Costing preliminary BOMs Independently create or participate in creating design and development documentation: Testing reports GPIO tables, bus resource allocation tables Power budget analysis documents HW planning and review documentsOther relevant documentation as may be required by the project Coordinate and interface with our OPs team for: Transitioning designs to MP Assisting with factory MP testing preparation Leading design issue resolution as it relates to MP Identifying substitutes and long L/T parts to assist in MP readinessIn Accordance with the Accessibility for Ontarians with Disabilities Act (AODA), iENSO strives to ensure that all recruiting processes are non-discriminatory. If you require accommodation, please advise HR in advance of attending the interview. Only candidates selected for an interview will be contacted. All other applicants are thanked for their interest.

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